An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy

URI: http://urn.fi/URN:NBN:fi:bib:me:W00581615100
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  • en
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  • An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy
P60049

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An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy

URI: http://urn.fi/URN:NBN:fi:bib:me:I00581615101
description
  • Yhteenveto-osa julkaistu myös verkkoaineistona ISBN 978-952-60-3500-0 (PDF)
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  • An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy

An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy

URI: http://urn.fi/URN:NBN:fi:bib:me:I00581615102
bookFormat
isPartOf
name
  • An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy
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An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy

URI: http://urn.fi/URN:NBN:fi:bib:me:I00581615100
datePublished
  • 2010
description
  • Artikkeliväitöskirjan yhteenveto-osa ja 6 eripainosta.
  • Julkaisussa virheellinen ISSN-tunnus 1457-0440.
  • Kannessa virheellisesti: Weigun Peng.
  • kuvitettu
  • Tekijän nimi kannessa virheellisesti Weigun Peng.
identifier
  • propertyID: FI-FENNI value: 990536
  • propertyID: FI-MELINDA value: 005816151
  • propertyID: skl value: fx990536
isbn
  • 9789526034997
isPartOf
name
  • An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy
numberOfPages
  • 77, [61] sivu
P60048
P60050
publication
  • location: Espoo organizer: Aalto-yliopiston teknillinen korkeakoulu
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