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Search works, persons, organizations and subjects:
Peng, Weiqun
URI:
http://urn.fi/URN:NBN:fi:au:pn:000147557
name
Peng, Weiqun
Authored works
An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy
Works contributed to
Works about Peng, Weiqun
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