{
  "@context": {
    "@vocab": "http://schema.org/",
    "rdau": "http://rdaregistry.info/Elements/u/",
    "skos": "http://www.w3.org/2004/02/skos/core#",
    "skos:prefLabel": {
      "@container": "@language"
    }
  },
  "@graph": [
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:W00581615100",
      "@type": [
        "CreativeWork",
        "http://id.loc.gov/ontologies/bibframe/Work"
      ],
      "author": {
        "@id": "http://urn.fi/URN:NBN:fi:au:pn:000147557"
      },
      "inLanguage": "en",
      "isPartOf": {
        "@id": "http://urn.fi/URN:NBN:fi:bib:me:CFENNI"
      },
      "name": "An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy",
      "rdau:P60049": {
        "@id": "http://rdaregistry.info/termList/RDAContentType/1020"
      },
      "workExample": [
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00581615100"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00581615102"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00581615101"
        }
      ]
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:W00390303700",
      "name": [
        "Report series / Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology",
        "Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology",
        "Teknillinen korkeakoulu, Sähkö- ja tietoliikennetekniikan osasto, Elektroniikan valmistustekniikka",
        "Hels. Univ. Technol., Dep. Electr. Commun. Eng., Lab. Electron. Prod. Technol",
        "Helsinki University of Technology. Department of Electrical and Communications Engineering. Laboratory of Electronics Production Technology",
        "Report series / Helsinki University of Technology, Laboratory of Electronics Production Technology",
        "Report series / Helsinki University of Technology. Laboratory of Electronics Production Technology",
        "Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology : electronics production technology publication series"
      ]
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00581615102",
      "@type": [
        "Book",
        "http://id.loc.gov/ontologies/bibframe/Instance",
        "CreativeWork"
      ],
      "bookFormat": {
        "@id": "http://schema.org/EBook"
      },
      "exampleOfWork": {
        "@id": "http://urn.fi/URN:NBN:fi:bib:me:W00581615100"
      },
      "isPartOf": [
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:W00390303700"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:CFENNI"
        }
      ],
      "name": "An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy",
      "url": {
        "@id": "http://lib.tkk.fi/Diss/2010/isbn9789526035000/isbn9789526035000.pdf"
      }
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:au:cn:172901A",
      "name": "Aalto-yliopiston teknillinen korkeakoulu"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:CFENNI",
      "name": "Fennica"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:au:pn:000147557",
      "name": "Peng, Weiqun"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00581615100",
      "@type": [
        "CreativeWork",
        "http://id.loc.gov/ontologies/bibframe/Instance"
      ],
      "datePublished": "2010",
      "description": [
        "Artikkeliväitöskirjan yhteenveto-osa ja 6 eripainosta.",
        "Kannessa virheellisesti: Weigun Peng.",
        "kuvitettu",
        "Julkaisussa virheellinen ISSN-tunnus 1457-0440.",
        "Tekijän nimi kannessa virheellisesti Weigun Peng."
      ],
      "exampleOfWork": {
        "@id": "http://urn.fi/URN:NBN:fi:bib:me:W00581615100"
      },
      "identifier": [
        {
          "@id": "_:ub13674bL51C31"
        },
        {
          "@id": "_:ub13674bL43C31"
        },
        {
          "@id": "_:ub13674bL47C31"
        }
      ],
      "isPartOf": [
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:CFENNI"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:W00390303700"
        }
      ],
      "isbn": "9789526034997",
      "name": "An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy",
      "numberOfPages": "77, [61] sivu",
      "publication": {
        "@id": "_:ub13674bL59C31"
      },
      "publisher": {
        "@id": "http://urn.fi/URN:NBN:fi:au:cn:172901A"
      },
      "rdau:P60048": {
        "@id": "http://rdaregistry.info/termList/RDACarrierType/1049"
      },
      "rdau:P60050": {
        "@id": "http://rdaregistry.info/termList/RDAMediaType/1007"
      }
    },
    {
      "@id": "_:ub13674bL51C31",
      "@type": "PropertyValue",
      "propertyID": "skl",
      "value": "fx990536"
    },
    {
      "@id": "_:ub13674bL59C31",
      "location": {
        "@id": "_:ub13674bL59C51"
      },
      "organizer": {
        "@id": "http://urn.fi/URN:NBN:fi:au:cn:172901A"
      }
    },
    {
      "@id": "_:ub13674bL59C51",
      "name": "Espoo"
    },
    {
      "@id": "_:ub13674bL43C31",
      "@type": "PropertyValue",
      "propertyID": "FI-MELINDA",
      "value": "005816151"
    },
    {
      "@id": "_:ub13674bL47C31",
      "@type": "PropertyValue",
      "propertyID": "FI-FENNI",
      "value": "990536"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00581615101",
      "@type": [
        "CreativeWork",
        "http://id.loc.gov/ontologies/bibframe/Instance"
      ],
      "description": "Yhteenveto-osa julkaistu myös verkkoaineistona ISBN 978-952-60-3500-0 (PDF)",
      "exampleOfWork": {
        "@id": "http://urn.fi/URN:NBN:fi:bib:me:W00581615100"
      },
      "isPartOf": [
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:W00390303700"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:CFENNI"
        }
      ],
      "name": "An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy"
    }
  ]
}