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An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy
URI:
http://urn.fi/URN:NBN:fi:bib:me:W00581615100
author
Peng, Weiqun
inLanguage
en
isPartOf
Fennica
name
An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy
P60049
<http://rdaregistry.info/termList/RDAContentType/1020>
Instances
-
-, e-book
2010 : Aalto-yliopiston teknillinen korkeakoulu
An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy
URI:
http://urn.fi/URN:NBN:fi:bib:me:I00581615101
description
Yhteenveto-osa julkaistu myös verkkoaineistona ISBN 978-952-60-3500-0 (PDF)
isPartOf
Fennica
Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology : electronics production technology publication series
name
An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy
An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy
URI:
http://urn.fi/URN:NBN:fi:bib:me:I00581615102
bookFormat
<http://schema.org/EBook>
isPartOf
Fennica
Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology : electronics production technology publication series
name
An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy
url
<http://lib.tkk.fi/Diss/2010/isbn9789526035000/isbn9789526035000.pdf>
View this in Finna
An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy
URI:
http://urn.fi/URN:NBN:fi:bib:me:I00581615100
datePublished
2010
description
Artikkeliväitöskirjan yhteenveto-osa ja 6 eripainosta.
Julkaisussa virheellinen ISSN-tunnus 1457-0440.
Kannessa virheellisesti: Weigun Peng.
kuvitettu
Tekijän nimi kannessa virheellisesti Weigun Peng.
identifier
propertyID:
FI-FENNI
value:
990536
propertyID:
FI-MELINDA
value:
005816151
propertyID:
skl
value:
fx990536
isbn
9789526034997
isPartOf
Fennica
Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology : electronics production technology publication series
name
An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy
numberOfPages
77, [61] sivu
P60048
<http://rdaregistry.info/termList/RDACarrierType/1049>
P60050
<http://rdaregistry.info/termList/RDAMediaType/1007>
publication
location:
Espoo
organizer:
Aalto-yliopiston teknillinen korkeakoulu
publisher
Aalto-yliopiston teknillinen korkeakoulu
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