Vibration test as a new method for studying the mechanical reliability of solder interconnections under shock loading conditions

URI: http://urn.fi/URN:NBN:fi:bib:me:W00394087000
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  • en
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  • Vibration test as a new method for studying the mechanical reliability of solder interconnections under shock loading conditions
P60049

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Vibration test as a new method for studying the mechanical reliability of solder interconnections under shock loading conditions

URI: http://urn.fi/URN:NBN:fi:bib:me:I00394087001
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  • Vibration test as a new method for studying the mechanical reliability of solder interconnections under shock loading conditions
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Vibration test as a new method for studying the mechanical reliability of solder interconnections under shock loading conditions

URI: http://urn.fi/URN:NBN:fi:bib:me:I00394087000
datePublished
  • 2007
description
  • kuvitettu
identifier
  • propertyID: FI-FENNI value: 859778
  • propertyID: FI-MELINDA value: 003940870
  • propertyID: skl value: fx859778
isbn
  • 9789512287345
  • 9789512287352
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  • Vibration test as a new method for studying the mechanical reliability of solder interconnections under shock loading conditions
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  • xiii, 128, [6] sivu
P60048
P60050
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  • location: Espoo organizer: Teknillinen korkeakoulu
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