@prefix ns1: .
@prefix rdf: .
@prefix rdfs: .
@prefix schema: .
@prefix skos: .
@prefix xml: .
@prefix xsd: .
schema:name "Marjamäki, Pekka" .
a ,
schema:CreativeWork ;
ns1:P60048 ;
ns1:P60050 ;
schema:datePublished "2007" ;
schema:description "kuvitettu" ;
schema:exampleOfWork ;
schema:identifier [ a schema:PropertyValue ;
schema:propertyID "FI-FENNI" ;
schema:value "859778" ],
[ a schema:PropertyValue ;
schema:propertyID "skl" ;
schema:value "fx859778" ],
[ a schema:PropertyValue ;
schema:propertyID "FI-MELINDA" ;
schema:value "003940870" ] ;
schema:isPartOf ,
;
schema:isbn "9789512287345",
"9789512287352" ;
schema:name "Vibration test as a new method for studying the mechanical reliability of solder interconnections under shock loading conditions" ;
schema:numberOfPages "xiii, 128, [6] sivu" ;
schema:publication [ schema:location [ schema:name "Espoo" ] ;
schema:organizer ] ;
schema:publisher .
a ,
schema:CreativeWork ;
schema:description "Julkaistu myös verkkoaineistona" ;
schema:exampleOfWork ;
schema:isPartOf ,
;
schema:name "Vibration test as a new method for studying the mechanical reliability of solder interconnections under shock loading conditions" .
schema:name "Teknillinen korkeakoulu. Elektroniikan valmistustekniikan laboratorio" .
schema:name "Teknillinen korkeakoulu" .
schema:name "Hels. Univ. Technol., Dep. Electr. Commun. Eng., Lab. Electron. Prod. Technol",
"Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology",
"Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology : electronics production technology publication series",
"Helsinki University of Technology. Department of Electrical and Communications Engineering. Laboratory of Electronics Production Technology",
"Report series / Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology",
"Report series / Helsinki University of Technology, Laboratory of Electronics Production Technology",
"Report series / Helsinki University of Technology. Laboratory of Electronics Production Technology",
"Teknillinen korkeakoulu, Sähkö- ja tietoliikennetekniikan osasto, Elektroniikan valmistustekniikka" .
a ,
schema:CreativeWork ;
ns1:P60049 ;
schema:author ;
schema:contributor ;
schema:inLanguage "en" ;
schema:isPartOf ;
schema:name "Vibration test as a new method for studying the mechanical reliability of solder interconnections under shock loading conditions" ;
schema:workExample ,
.
schema:name "Fennica" .