Reliability of SnAgCu solder joints under thermo-mechanical stresses

URI: http://urn.fi/URN:NBN:fi:bib:me:W01152132300
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contributor
inLanguage
  • en
isPartOf
name
  • Reliability of SnAgCu solder joints under thermo-mechanical stresses
P60049

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Reliability of SnAgCu solder joints under thermo-mechanical stresses

URI: http://urn.fi/URN:NBN:fi:bib:me:I01152132301
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isPartOf
name
  • Reliability of SnAgCu solder joints under thermo-mechanical stresses
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Reliability of SnAgCu solder joints under thermo-mechanical stresses

URI: http://urn.fi/URN:NBN:fi:bib:me:I01152132300
datePublished
  • 2005
description
  • kuvitettu
  • Tiivistelmä ja 6 erip.
identifier
  • propertyID: FI-FENNI value: 783174
  • propertyID: FI-MELINDA value: 000345629
  • propertyID: FI-MELINDA value: 005107661
  • propertyID: skl value: fx783174
isbn
  • 9521512954
isPartOf
name
  • Reliability of SnAgCu solder joints under thermo-mechanical stresses
numberOfPages
  • VIII, 45, [70] s.
P60048
P60050
publication
  • location: Tampere organizer: Tampere Unversity of Technology
publisher
  • Tampere Unversity of Technology

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