Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections

URI: http://urn.fi/URN:NBN:fi:bib:me:W00045318500
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inLanguage
  • en
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name
  • Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections
P60049

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Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections

URI: http://urn.fi/URN:NBN:fi:bib:me:I00045318501
description
  • Julkaistu myös verkkoaineistona
isPartOf
name
  • Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections
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Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections

URI: http://urn.fi/URN:NBN:fi:bib:me:I00045318500
datePublished
  • 2006
description
  • kuvitettu
  • Tiivistelmä ja 6 erip.
identifier
  • propertyID: FI-FENNI value: 847574
  • propertyID: FI-MELINDA value: 000453185
  • propertyID: skl value: fx847574
isbn
  • 9512284642
  • 9789512284634
  • 9789512284641
isPartOf
name
  • Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections
numberOfPages
  • II, VII, 48, [75] sivu
P60048
P60050
publication
  • location: Espoo organizer: Teknillinen korkeakoulu
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