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schema:name "Yu, Hao" .
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schema:datePublished "2006" ;
schema:description "Tiivistelmä ja 6 erip.",
"kuvitettu" ;
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schema:isbn "9512284642",
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schema:name "Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections" ;
schema:numberOfPages "II, VII, 48, [75] sivu" ;
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schema:name "Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections" .
schema:name "Teknillinen korkeakoulu. Elektroniikan valmistustekniikan laboratorio" .
schema:name "Teknillinen korkeakoulu" .
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schema:name "Hels. Univ. Technol., Dep. Electr. Commun. Eng., Lab. Electron. Prod. Technol",
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