Reliability of high-density lead-free solder interconnections under thermal cycling and mechanical shock loading

author

• Mattila, Toni

contributor

• Teknillinen korkeakoulu. Elektroniikan valmistustekniikan laboratorio

inLanguage

• en

isPartOf

• Fennica

name

• Reliability of high-density lead-free solder interconnections under thermal cycling and mechanical shock loading

P60049

• <http://rdaregistry.info/termList/RDAContentType/1020>

Instances

• -
• 2005 : Teknillinen korkeakoulu