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schema:name "Mattila, Toni" .
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schema:datePublished "2005" ;
schema:description "Tiivistelmä ja 5 erip.",
"kuvitettu" ;
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schema:isbn "9512279835",
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schema:name "Reliability of high-density lead-free solder interconnections under thermal cycling and mechanical shock loading" ;
schema:numberOfPages "56, [146] sivu" ;
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schema:name "Reliability of high-density lead-free solder interconnections under thermal cycling and mechanical shock loading" .
schema:name "Teknillinen korkeakoulu. Elektroniikan valmistustekniikan laboratorio" .
schema:name "Teknillinen korkeakoulu" .
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schema:name "Hels. Univ. Technol., Dep. Electr. Commun. Eng., Lab. Electron. Prod. Technol",
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