Stability of TaC diffusion barrier between Si and Cu

Stability of TaC diffusion barrier between Si and Cu

datePublished

• 2001

description

• kuvitettu

identifier

• propertyID: FI-FENNI value: 706708
• propertyID: FI-MELINDA value: 003905386
• propertyID: skl value: fx706708

isbn

• 9512257777

isPartOf

• Fennica
• Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology

name

• Stability of TaC diffusion barrier between Si and Cu

numberOfPages

• 26 s.

P60048

• <http://rdaregistry.info/termList/RDACarrierType/1049>

P60050

• <http://rdaregistry.info/termList/RDAMediaType/1007>

publication

• location: Espoo organizer: Teknillinen korkeakoulu

publisher

• Teknillinen korkeakoulu