@prefix ns1: .
@prefix rdf: .
@prefix rdfs: .
@prefix schema: .
@prefix skos: .
@prefix xml: .
@prefix xsd: .
schema:name "AgSn-based solder alloys and solder/conductor interactions in lead-free electronics" .
schema:name "Formation of the intermetallic compounds between liquid Sn and different Cu-Ni metalization" .
schema:name "Interfacial adhesion in metal/polymer systems for electronics" .
schema:name "Reactive blending approach to modify spin coated epoxy film" .
schema:name "Reliability of high-density lead-free solder interconnections under thermal cycling and mechanical shock loading" .
schema:name "Reliability of high-density lead-free solder interconnections under thermal cycling and mechanical shock loading" .
schema:name "Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections" .
schema:name "Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections" .
schema:name "Interfacial reactions between Sn-based solders and common metallisations used in electronics" .
schema:name "Interfacial reactions between Sn-based solders and common metallisations used in electronics" .
a ,
schema:CreativeWork,
schema:Periodical ;
ns1:P60048 ;
ns1:P60050 ;
schema:datePublished "1999-2007",
"1999/2007" ;
schema:description "Ceased publication",
"Kuvailun perusta: 3 (2001)." ;
schema:exampleOfWork ;
schema:identifier [ a schema:PropertyValue ;
schema:propertyID "FI-FENNI" ;
schema:value "642193" ],
[ a schema:PropertyValue ;
schema:propertyID "FI-MELINDA" ;
schema:value "003903037" ],
[ a schema:PropertyValue ;
schema:propertyID "skl" ;
schema:value "fx642193" ] ;
schema:isPartOf ;
schema:issn "1457-0440" ;
schema:name "Hels. Univ. Technol., Dep. Electr. Commun. Eng., Lab. Electron. Prod. Technol",
"Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology",
"Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology : electronics production technology publication series",
"Report series / Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology",
"Teknillinen korkeakoulu, Sähkö- ja tietoliikennetekniikan osasto, Elektroniikan valmistustekniikka" ;
schema:publication [ schema:location [ schema:name "Espoo" ] ;
schema:organizer ] ;
schema:publisher ;
schema:sameAs .
schema:name "Stability of TaC diffusion barrier between Si and Cu" .
schema:name "Interfacial compatibility of polymer-based structures in electronics" .
schema:name "Interfacial compatibility of polymer-based structures in electronics" .
schema:name "Reliability assessment of telecommunications equipment" .
schema:name "Reliability assessment of telecommunications equipment" .
schema:name "Vibration test as a new method for studying the mechanical reliability of solder interconnections under shock loading conditions" .
schema:name "Vibration test as a new method for studying the mechanical reliability of solder interconnections under shock loading conditions" .
schema:name "Time-dependent microstructural and compositional changes at the interfaces between materials in electronics" .
schema:name "Tantalum-based diffusion barriers for copper metallization" .
schema:name "An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy" .
schema:name "An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy" .
schema:name "An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy" .
schema:name "Teknillinen korkeakoulu. Elektroniikan valmistustekniikka" .
a ,
schema:CreativeWork,
schema:CreativeWorkSeries,
schema:Periodical ;
ns1:P60049 ;
schema:contributor ;
schema:hasPart ,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
;
schema:inLanguage "en" ;
schema:isPartOf ;
schema:issn "1457-0440" ;
schema:name "Hels. Univ. Technol., Dep. Electr. Commun. Eng., Lab. Electron. Prod. Technol",
"Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology",
"Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology : electronics production technology publication series",
"Helsinki University of Technology. Department of Electrical and Communications Engineering. Laboratory of Electronics Production Technology",
"Report series / Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology",
"Report series / Helsinki University of Technology, Laboratory of Electronics Production Technology",
"Report series / Helsinki University of Technology. Laboratory of Electronics Production Technology",
"Teknillinen korkeakoulu, Sähkö- ja tietoliikennetekniikan osasto, Elektroniikan valmistustekniikka" ;
schema:sameAs ;
schema:workExample .
schema:name "Teknillinen korkeakoulu" .
schema:name "Fennica" .