{
  "@context": {
    "@vocab": "http://schema.org/",
    "rdau": "http://rdaregistry.info/Elements/u/",
    "skos": "http://www.w3.org/2004/02/skos/core#",
    "skos:prefLabel": {
      "@container": "@language"
    }
  },
  "@graph": [
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00046920901",
      "name": "Interfacial reactions between Sn-based solders and common metallisations used in electronics"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00029721400",
      "name": "Interfacial adhesion in metal/polymer systems for electronics"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00040658600",
      "name": "Reliability of high-density lead-free solder interconnections under thermal cycling and mechanical shock loading"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00392169401",
      "name": "Interfacial compatibility of polymer-based structures in electronics"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:O00390303701",
      "name": "Teknillinen korkeakoulu. Elektroniikan valmistustekniikka"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00581615101",
      "name": "An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:W00390303700",
      "@type": [
        "CreativeWork",
        "Periodical",
        "CreativeWorkSeries",
        "http://id.loc.gov/ontologies/bibframe/Work"
      ],
      "contributor": {
        "@id": "http://urn.fi/URN:NBN:fi:bib:me:O00390303701"
      },
      "hasPart": [
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00581615100"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00031118400"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00394087000"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00040658601"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00046920901"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00024782000"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00046920900"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00045318501"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00581615102"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00392169401"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00024373300"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00392169400"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00040658600"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00581615101"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00530962700"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00392513201"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00029721400"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00045318500"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00551636400"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00390538600"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00394087001"
        },
        {
          "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00392513200"
        }
      ],
      "inLanguage": "en",
      "isPartOf": {
        "@id": "http://urn.fi/URN:NBN:fi:bib:me:CFENNI"
      },
      "issn": "1457-0440",
      "name": [
        "Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology",
        "Report series / Helsinki University of Technology. Laboratory of Electronics Production Technology",
        "Hels. Univ. Technol., Dep. Electr. Commun. Eng., Lab. Electron. Prod. Technol",
        "Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology : electronics production technology publication series",
        "Report series / Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology",
        "Report series / Helsinki University of Technology, Laboratory of Electronics Production Technology",
        "Teknillinen korkeakoulu, Sähkö- ja tietoliikennetekniikan osasto, Elektroniikan valmistustekniikka",
        "Helsinki University of Technology. Department of Electrical and Communications Engineering. Laboratory of Electronics Production Technology"
      ],
      "rdau:P60049": {
        "@id": "http://rdaregistry.info/termList/RDAContentType/1020"
      },
      "sameAs": {
        "@id": "https://issn.org/resource/issn/1457-0440"
      },
      "workExample": {
        "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00390303700"
      }
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00024373300",
      "name": "AgSn-based solder alloys and solder/conductor interactions in lead-free electronics"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00551636400",
      "name": "Tantalum-based diffusion barriers for copper metallization"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00390303700",
      "@type": [
        "CreativeWork",
        "Periodical",
        "http://id.loc.gov/ontologies/bibframe/Instance"
      ],
      "datePublished": [
        "1999/2007",
        "1999-2007"
      ],
      "description": [
        "Kuvailun perusta: 3 (2001).",
        "Ceased publication"
      ],
      "exampleOfWork": {
        "@id": "http://urn.fi/URN:NBN:fi:bib:me:W00390303700"
      },
      "identifier": [
        {
          "@id": "_:ub4370bL85C31"
        },
        {
          "@id": "_:ub4370bL93C31"
        },
        {
          "@id": "_:ub4370bL89C31"
        }
      ],
      "isPartOf": {
        "@id": "http://urn.fi/URN:NBN:fi:bib:me:CFENNI"
      },
      "issn": "1457-0440",
      "name": [
        "Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology : electronics production technology publication series",
        "Report series / Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology",
        "Teknillinen korkeakoulu, Sähkö- ja tietoliikennetekniikan osasto, Elektroniikan valmistustekniikka",
        "Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology",
        "Hels. Univ. Technol., Dep. Electr. Commun. Eng., Lab. Electron. Prod. Technol"
      ],
      "publication": {
        "@id": "_:ub4370bL100C31"
      },
      "publisher": {
        "@id": "http://urn.fi/URN:NBN:fi:au:cn:28789A"
      },
      "rdau:P60048": {
        "@id": "http://rdaregistry.info/termList/RDACarrierType/1049"
      },
      "rdau:P60050": {
        "@id": "http://rdaregistry.info/termList/RDAMediaType/1007"
      },
      "sameAs": {
        "@id": "https://issn.org/resource/issn/1457-0440"
      }
    },
    {
      "@id": "_:ub4370bL85C31",
      "@type": "PropertyValue",
      "propertyID": "FI-FENNI",
      "value": "642193"
    },
    {
      "@id": "_:ub4370bL93C31",
      "@type": "PropertyValue",
      "propertyID": "skl",
      "value": "fx642193"
    },
    {
      "@id": "_:ub4370bL100C31",
      "location": {
        "@id": "_:ub4370bL100C51"
      },
      "organizer": {
        "@id": "http://urn.fi/URN:NBN:fi:au:cn:28789A"
      }
    },
    {
      "@id": "_:ub4370bL100C51",
      "name": "Espoo"
    },
    {
      "@id": "_:ub4370bL89C31",
      "@type": "PropertyValue",
      "propertyID": "FI-MELINDA",
      "value": "003903037"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00390538600",
      "name": "Stability of TaC diffusion barrier between Si and Cu"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:CFENNI",
      "name": "Fennica"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00530962700",
      "name": "Time-dependent microstructural and compositional changes at the interfaces between materials in electronics"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00392513201",
      "name": "Reliability assessment of telecommunications equipment"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00046920900",
      "name": "Interfacial reactions between Sn-based solders and common metallisations used in electronics"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00392513200",
      "name": "Reliability assessment of telecommunications equipment"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00394087001",
      "name": "Vibration test as a new method for studying the mechanical reliability of solder interconnections under shock loading conditions"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00045318500",
      "name": "Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00581615100",
      "name": "An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00045318501",
      "name": "Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00581615102",
      "name": "An investigation of reliability of high density electronic package-to-board interconnections from the perspective of solder joint metallurgy"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00394087000",
      "name": "Vibration test as a new method for studying the mechanical reliability of solder interconnections under shock loading conditions"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00040658601",
      "name": "Reliability of high-density lead-free solder interconnections under thermal cycling and mechanical shock loading"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:au:cn:28789A",
      "name": "Teknillinen korkeakoulu"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00031118400",
      "name": "Reactive blending approach to modify spin coated epoxy film"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00392169400",
      "name": "Interfacial compatibility of polymer-based structures in electronics"
    },
    {
      "@id": "http://urn.fi/URN:NBN:fi:bib:me:I00024782000",
      "name": "Formation of the intermetallic compounds between liquid Sn and different Cu-Ni metalization"
    }
  ]
}