Formation of the intermetallic compounds between liquid Sn and different Cu-Ni metalization

Formation of the intermetallic compounds between liquid Sn and different Cu-Ni metalization

datePublished

• 2001

description

• kuvitettu

identifier

• propertyID: FI-FENNI value: 706706
• propertyID: FI-MELINDA value: 000247820
• propertyID: skl value: fx706706

isbn

• 9512256290

isPartOf

• Fennica
• Report series / Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology

name

• Formation of the intermetallic compounds between liquid Sn and different Cu-Ni metalization

numberOfPages

• 14 s.

P60048

• <http://rdaregistry.info/termList/RDACarrierType/1049>

P60050

• <http://rdaregistry.info/termList/RDAMediaType/1007>

publication

• location: Espoo organizer: Teknillinen korkeakoulu

publisher

• Teknillinen korkeakoulu