Tantalum-based diffusion barriers for copper metallization

Tantalum-based diffusion barriers for copper metallization

datePublished

• 2001

description

• kuvitettu
• Tiivistelmä ja 5 erip. - Nimiösivulla myös: Helsinki University of Technology, Department of Electrical and Communications Engineering, Laboratory of Electronics Production Technology

identifier

• propertyID: FI-FENNI value: 704742
• propertyID: FI-MELINDA value: 005516364
• propertyID: skl value: fx704742

isbn

• 9512257661

isPartOf

• Fennica
• Report series / Helsinki University of Technology. Laboratory of Electronics Production Technology
• Teknillinen korkeakoulu. Elektroniikan valmistustekniikan laboratorio. Report series

name

• Tantalum-based diffusion barriers for copper metallization

numberOfPages

• 58, [66]

P60048

• <http://rdaregistry.info/termList/RDACarrierType/1049>

P60050

• <http://rdaregistry.info/termList/RDAMediaType/1007>

publication

• location: Espoo organizer: Teknillinen korkeakoulu

publisher

• Teknillinen korkeakoulu