Additive and digital fabrication of 3D interconnects in MEMS packaging using printing technologies

URI: http://urn.fi/URN:NBN:fi:bib:me:W01259864500
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  • en
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  • Additive and digital fabrication of 3D interconnects in MEMS packaging using printing technologies
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Additive and digital fabrication of 3D interconnects in MEMS packaging using printing technologies

URI: http://urn.fi/URN:NBN:fi:bib:me:I01259864501
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  • Yhteenveto-osa julkaistu myös verkkoaineistona
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  • Additive and digital fabrication of 3D interconnects in MEMS packaging using printing technologies

Additive and digital fabrication of 3D interconnects in MEMS packaging using printing technologies

URI: http://urn.fi/URN:NBN:fi:bib:me:I01259864502
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  • 9789521541636
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name
  • Additive and digital fabrication of 3D interconnects in MEMS packaging using printing technologies

Additive and digital fabrication of 3D interconnects in MEMS packaging using printing technologies

URI: http://urn.fi/URN:NBN:fi:bib:me:I01259864503
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isPartOf
name
  • Additive and digital fabrication of 3D interconnects in MEMS packaging using printing technologies
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Additive and digital fabrication of 3D interconnects in MEMS packaging using printing technologies

URI: http://urn.fi/URN:NBN:fi:bib:me:I01259864500
datePublished
  • 2018
description
  • Artikkeliväitöskirjan yhteenveto-osa ja kuusi eripainosta.
  • kuvitettu
  • Valvoja: Matti Mäntysalo.
isbn
  • 9789521541544
isPartOf
name
  • Additive and digital fabrication of 3D interconnects in MEMS packaging using printing technologies
numberOfPages
  • ix, 55 sivua, 48 numeroimatonta sivua
P60048
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publication
  • location: Tampere organizer: Tampereen teknillinen yliopisto = Tampere University of Technology
publisher
  • Tampereen teknillinen yliopisto = Tampere University of Technology

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