Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages

URI: http://urn.fi/URN:NBN:fi:bib:me:W00591499400
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Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages

URI: http://urn.fi/URN:NBN:fi:bib:me:I00594714801
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  • Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages

Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages

URI: http://urn.fi/URN:NBN:fi:bib:me:I00591499401
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  • Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages

Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages

URI: http://urn.fi/URN:NBN:fi:bib:me:I00591499402
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  • 9789526041476
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  • Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages

Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages

URI: http://urn.fi/URN:NBN:fi:bib:me:I00594714802
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  • 9789526041469
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  • Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages

Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages

URI: http://urn.fi/URN:NBN:fi:bib:me:I00591499403
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Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages

URI: http://urn.fi/URN:NBN:fi:bib:me:I00591499400
datePublished
  • 2011
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  • Artikkeliväitöskirjan yhteenveto-osa ja 6 eripainosta.
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  • propertyID: FI-FENNI value: 981236
  • propertyID: FI-MELINDA value: 005914994
  • propertyID: skl value: fx981236
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  • 9789526041469
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  • Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages
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  • 52, [59] sivu
P60048
P60050
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  • location: Espoo organizer: Aalto-yliopisto
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Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages

URI: http://urn.fi/URN:NBN:fi:bib:me:I00594714800
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  • 2011
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  • Artikkeliväitöskirjan yhteenveto-osa.
  • Nimeke nimiösivulta.
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  • propertyID: FI-MELINDA value: 005947148
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  • 9789526041476
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  • Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages
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  • 1 verkkoaineisto (55 s.)
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  • location: Espoo organizer: Aalto-yliopisto
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