Characterization of second-level lead-free BGA interconnections in thermomechanically loaded LTCC/PWB assemblies

URI: http://urn.fi/URN:NBN:fi:bib:me:W00580324000
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  • en
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  • Characterization of second-level lead-free BGA interconnections in thermomechanically loaded LTCC/PWB assemblies
P60049

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Characterization of second-level lead-free BGA interconnections in thermomechanically loaded LTCC/PWB assemblies

URI: http://urn.fi/URN:NBN:fi:bib:me:I00580324001
description
  • Yhteenveto-osa myös verkkoaineistona ISBN 978-951-42-6353-8 (PDF)
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  • Characterization of second-level lead-free BGA interconnections in thermomechanically loaded LTCC/PWB assemblies

Characterization of second-level lead-free BGA interconnections in thermomechanically loaded LTCC/PWB assemblies

URI: http://urn.fi/URN:NBN:fi:bib:me:I00580324002
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  • Characterization of second-level lead-free BGA interconnections in thermomechanically loaded LTCC/PWB assemblies
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Characterization of second-level lead-free BGA interconnections in thermomechanically loaded LTCC/PWB assemblies

URI: http://urn.fi/URN:NBN:fi:bib:me:I00580324000
datePublished
  • 2010
description
  • Artikkeliväitöskirjan yhteenveto-osa ja 5 eripainosta.
  • kuvitettu
identifier
  • propertyID: FI-FENNI value: 963813
  • propertyID: FI-MELINDA value: 005803240
  • propertyID: skl value: fx963813
isbn
  • 9789514263521
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name
  • Characterization of second-level lead-free BGA interconnections in thermomechanically loaded LTCC/PWB assemblies
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  • 92, [82] sivu
P60048
P60050
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  • location: Oulu organizer: Oulun yliopisto
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