Mechanical properties of solder joints and optimization of soldering process yield using Sn/Ag/Cu alloys

URI: http://urn.fi/URN:NBN:fi:bib:me:W00508449700
author
inLanguage
  • en
isPartOf
name
  • Mechanical properties of solder joints and optimization of soldering process yield using Sn/Ag/Cu alloys
P60049

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Mechanical properties of solder joints and optimization of soldering process yield using Sn/Ag/Cu alloys

URI: http://urn.fi/URN:NBN:fi:bib:me:I00508449700
datePublished
  • 2004
description
  • kuvitettu
  • Tiivistelmä ja 6 erip.
identifier
  • propertyID: FI-FENNI value: 781197
  • propertyID: FI-MELINDA value: 005084497
  • propertyID: skl value: fx781197
isbn
  • 9521511451
isPartOf
name
  • Mechanical properties of solder joints and optimization of soldering process yield using Sn/Ag/Cu alloys
numberOfPages
  • x, 58, [89]
P60048
P60050
publication
  • location: Tampere organizer: Tampereen teknillinen korkeakoulu Tampereen teknillinen yliopisto. Optoelektroniikan tutkimuskeskus
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