Combined electrical and thermal circuit simulation using APLAC : Part B, Electrothermal diode and transistor

URI: http://urn.fi/URN:NBN:fi:bib:me:W00080885400
author
contributor
inLanguage
  • en
isPartOf
name
  • Combined electrical and thermal circuit simulation using APLAC : Part 100, Thermal spreading impedance models
  • Combined electrical and thermal circuit simulation using APLAC : Part A, Implementation and basic component models
  • Combined electrical and thermal circuit simulation using APLAC : Part B, Electrothermal diode and transistor
P60049

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Combined electrical and thermal circuit simulation using APLAC : Part A, Implementation and basic component models

URI: http://urn.fi/URN:NBN:fi:bib:me:I00080885400
datePublished
  • 1995
description
  • kuvitettu
identifier
  • propertyID: FI-FENNI value: 442757
  • propertyID: FI-MELINDA value: 000808854
  • propertyID: skl value: fx442757
isbn
  • 9512226618
isPartOf
name
  • Combined electrical and thermal circuit simulation using APLAC : Part A, Implementation and basic component models
numberOfPages
  • 54, [6] s.
P60048
P60050
publication
  • location: Espoo organizer: Teknillinen korkeakoulu
publisher
View this in Finna

Combined electrical and thermal circuit simulation using APLAC : Part B, Electrothermal diode and transistor

URI: http://urn.fi/URN:NBN:fi:bib:me:I00083356700
datePublished
  • 1996
description
  • kuvitettu
identifier
  • propertyID: FI-FENNI value: 490968
  • propertyID: FI-MELINDA value: 000833567
  • propertyID: skl value: fx490968
isbn
  • 9512228564
isPartOf
name
  • Combined electrical and thermal circuit simulation using APLAC : Part B, Electrothermal diode and transistor
numberOfPages
  • iv, 48, [2] s.
P60048
P60050
publication
  • location: Espoo organizer: Teknillinen korkeakoulu
publisher
View this in Finna

Combined electrical and thermal circuit simulation using APLAC : Part 100, Thermal spreading impedance models

URI: http://urn.fi/URN:NBN:fi:bib:me:I00089323500
datePublished
  • 1998
description
  • kuvitettu
identifier
  • propertyID: FI-FENNI value: 611881
  • propertyID: FI-MELINDA value: 000893235
  • propertyID: skl value: fx611881
isbn
  • 9512239833
isPartOf
name
  • Combined electrical and thermal circuit simulation using APLAC : Part 100, Thermal spreading impedance models
numberOfPages
  • ii, 54, [3] s.
P60048
P60050
publication
  • location: Espoo organizer: Teknillinen korkeakoulu
publisher

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