Direct wafer bonding for MEMS and microelectronics

URI: http://urn.fi/URN:NBN:fi:bib:me:W00044512700

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author

Suni, Tommi

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en

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Fennica

name

Direct wafer bonding for MEMS and microelectronics

P60049

<http://rdaregistry.info/termList/RDAContentType/1020>

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2006 : VTT

Direct wafer bonding for MEMS and microelectronics

URI: http://urn.fi/URN:NBN:fi:bib:me:I00044512701

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Julkaistu myös verkkoaineistona

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Direct wafer bonding for MEMS and microelectronics

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Direct wafer bonding for MEMS and microelectronics

URI: http://urn.fi/URN:NBN:fi:bib:me:I00044512700

datePublished

2006

description

kuvitettu
Tiivistelmä ja 6 erip.

identifier

propertyID: FI-FENNI value: 834029
propertyID: FI-MELINDA value: 000445127
propertyID: skl value: fx834029

isbn

9513868516

isPartOf

name

Direct wafer bonding for MEMS and microelectronics

numberOfPages

89, [42] sivu

P60048

<http://rdaregistry.info/termList/RDACarrierType/1049>

P60050

<http://rdaregistry.info/termList/RDAMediaType/1007>

publication

location: Espoo organizer: VTT

publisher

VTT

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