Anisotropic adhesive interconnection : an alternative for solder joints in high density electrical contacts

URI: http://urn.fi/URN:NBN:fi:bib:me:W00023665000
author
inLanguage
  • en
isPartOf
name
  • Anisotropic adhesive interconnection : an alternative for solder joints in high density electrical contacts
P60049

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Anisotropic adhesive interconnection : an alternative for solder joints in high density electrical contacts

URI: http://urn.fi/URN:NBN:fi:bib:me:I00023665000
datePublished
  • 2001
description
  • kuvitettu
  • Tiivistelmä ja 7 erip.
identifier
  • propertyID: FI-FENNI value: 699259
  • propertyID: FI-MELINDA value: 000236650
  • propertyID: skl value: fx699259
isbn
  • 952150644X
isPartOf
name
  • Anisotropic adhesive interconnection : an alternative for solder joints in high density electrical contacts
numberOfPages
  • VI, 42, [50] s.
P60048
P60050
publication
  • location: Tampere organizer: Tampereen teknillinen korkeakoulu Tampereen teknillinen yliopisto. Optoelektroniikan tutkimuskeskus
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